JPS6127913B2 - - Google Patents
Info
- Publication number
- JPS6127913B2 JPS6127913B2 JP14355884A JP14355884A JPS6127913B2 JP S6127913 B2 JPS6127913 B2 JP S6127913B2 JP 14355884 A JP14355884 A JP 14355884A JP 14355884 A JP14355884 A JP 14355884A JP S6127913 B2 JPS6127913 B2 JP S6127913B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- board
- screw
- contact part
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14355884A JPS6041246A (ja) | 1984-07-11 | 1984-07-11 | 放熱板取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14355884A JPS6041246A (ja) | 1984-07-11 | 1984-07-11 | 放熱板取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6041246A JPS6041246A (ja) | 1985-03-04 |
JPS6127913B2 true JPS6127913B2 (en]) | 1986-06-27 |
Family
ID=15341529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14355884A Granted JPS6041246A (ja) | 1984-07-11 | 1984-07-11 | 放熱板取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6041246A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102719673B1 (ko) * | 2024-03-04 | 2024-10-21 | 혜윰기술 주식회사 | 기능안전을 고려한 차량용 발열 제어 시스템 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5386144A (en) * | 1993-06-18 | 1995-01-31 | Lsi Logic Corporation | Snap on heat sink attachment |
US5977622A (en) * | 1997-04-25 | 1999-11-02 | Lsi Logic Corporation | Stiffener with slots for clip-on heat sink attachment |
US5898571A (en) * | 1997-04-28 | 1999-04-27 | Lsi Logic Corporation | Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages |
-
1984
- 1984-07-11 JP JP14355884A patent/JPS6041246A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102719673B1 (ko) * | 2024-03-04 | 2024-10-21 | 혜윰기술 주식회사 | 기능안전을 고려한 차량용 발열 제어 시스템 |
Also Published As
Publication number | Publication date |
---|---|
JPS6041246A (ja) | 1985-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5343362A (en) | Heat sink assembly | |
US4972294A (en) | Heat sink clip assembly | |
US6154365A (en) | Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly | |
JPS6127913B2 (en]) | ||
JPH08181474A (ja) | パワー構成部分と放熱子の緊締装置及びその装置のプリント回路板への取付け方法 | |
JPH0729895U (ja) | 電子部品の取り付け構造 | |
JPH0617309Y2 (ja) | 半導体の放熱装置 | |
JPS6228768Y2 (en]) | ||
JPH0648864Y2 (ja) | パワートランジスタの取付構造 | |
JP2546304Y2 (ja) | 半導体素子の固定装置 | |
JPS6322683Y2 (en]) | ||
JPH087651Y2 (ja) | 電子部品の保持構造 | |
JP3050723U (ja) | 固定具を備えたヒートシンク | |
JPS5911484Y2 (ja) | プリント基板の支持装置 | |
JP2506808Y2 (ja) | 放熱板用半導体固定装置 | |
JPH0617310Y2 (ja) | 放熱板の固定構造 | |
JPH0637419A (ja) | 放熱板固定装置 | |
JP3278697B2 (ja) | 半導体装置 | |
JP2533023Y2 (ja) | スライドスイッチ | |
JPH0510393Y2 (en]) | ||
JPH05315483A (ja) | プリント配線板装着素子の放熱フィンへの固定方法 | |
JPH01283990A (ja) | 半導体素子のリード端子位置決め装置 | |
JPS6144446Y2 (en]) | ||
JPS583432B2 (ja) | 陰極線管取付装置 | |
JP2779900B2 (ja) | 音響機器 |